512M-bit SLC NAND Flash memory, featuring a parallel interface and 1.8V operation. This Thin Fine Pitch Ball Grid Array (TFBGA) component offers 32M words x 16 bits, with a 15µs access time. Designed for surface mounting, it has 55 pins arranged in a 0.8mm pitch BGA package measuring 10mm x 8mm x 0.8mm. Operating temperature range is -40°C to 85°C.
PackageTFBGA
MountingSurface Mount
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Technical Specifications
Micron NAND512R4A0CZB6E technical specifications.
General
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | TFBGA |
| Package Description | Thin Fine Pitch Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 55 |
| PCB | 55 |
| Package Length (mm) | 10 |
| Package Width (mm) | 8 |
| Package Height (mm) | 0.8 |
| Seated Plane Height (mm) | 0.8 |
| Pin Pitch (mm) | 0.8 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Density | 512Mbit |
| Interface Type | Parallel |
| Maximum Operating Current | 15mA |
| Block Organization | Symmetrical |
| Architecture | Sectored |
| Timing Type | Asynchronous |
| Maximum Access Time | 15000ns |
| Number of Words | 32M |
| Boot Block | No |
| Typical Operating Supply Voltage | 1.8V |
| Address Bus Width | 26bit |
| Number of Bits per Word | 16bit |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 85°C |
Compliance
| Cage Code | 6Y440 |
| EU RoHS | Yes |
| HTS Code | 8542320071 |
| Schedule B | 8542320070 |
| ECCN | 3A991.b.1.a |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2002/95/EC |
Datasheet
Micron NAND512R4A0CZB6E Datasheet
Download the complete datasheet for Micron NAND512R4A0CZB6E to view detailed technical specifications.
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