256M-bit NOR Flash memory with a parallel interface, offering 3V/3.3V operation and a maximum access time of 95ns. This surface-mount integrated circuit features a 64-pin EZBGA package with a 13mm x 10mm footprint and 1mm pin pitch. The memory architecture is sectored and block-organized, supporting 32M x 8 or 16M x 16 word configurations with a 25/24-bit address bus. Operating temperature range is -40°C to 85°C.
PackageEZBGA
MountingSurface Mount
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Technical Specifications
Micron RC 28F256J3D-95 technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
EZBGA
Lead Shape
Ball
Pin Count
64
PCB
64
Package Length (mm)
13
Package Width (mm)
10
Package Height (mm)
0.78
Seated Plane Height (mm)
1.2(Max)
Pin Pitch (mm)
1
Package Material
Plastic
Mounting
Surface Mount
Density
256Mbit
Interface Type
Parallel
Block Organization
Symmetrical
Architecture
Sectored
Timing Type
Asynchronous
Maximum Access Time
95ns
Number of Words
32M/16M
Boot Block
No
Typical Operating Supply Voltage
3|3.3V
Address Bus Width
25/24bit
Number of Bits per Word
8/16bit
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
Compliance
Cage Code
6Y440
HTS Code
8542320071
Schedule B
8542320070
ECCN
3A991.b.1.a
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2002/95/EC
Datasheet
Micron RC 28F256J3D-95 Datasheet
Download the complete datasheet for Micron RC 28F256J3D-95 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.