256M-bit NOR Flash memory with a parallel interface, featuring 16M words x 16 bits. This surface-mount component operates at 1.8V with a maximum access time of 100ns. It utilizes a 64-pin EZBGA package (13x10x0.78mm) with a 1mm pin pitch. The memory architecture is sectored with asymmetrical block organization and includes a top boot block. Operating temperature range is -40°C to 85°C.
PackageEZBGA
MountingSurface Mount
Quick Jump:
Technical Specifications
Micron RC28F256P30TF technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
EZBGA
Pin Count
64
PCB
64
Package Length (mm)
13
Package Width (mm)
10
Package Height (mm)
0.78
Seated Plane Height (mm)
1.2(Max)
Pin Pitch (mm)
1
Package Material
Plastic
Mounting
Surface Mount
Density
256Mbit
Interface Type
Parallel
Maximum Operating Current
31mA
Block Organization
Asymmetrical
Architecture
Sectored
Programming Voltage
0.9 to 3.6|8.5 to 9.5V
Timing Type
Asynchronous|Synchronous
Maximum Access Time
100ns
Number of Words
16M
Boot Block
Yes
Typical Operating Supply Voltage
1.8V
Address Bus Width
24bit
Location of Boot Block
Top
Number of Bits per Word
16bit
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
Compliance
Cage Code
6Y440
EU RoHS
No
HTS Code
8542320071
Schedule B
8542320070
ECCN
3A991.b.1.a
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Micron RC28F256P30TF Datasheet
Download the complete datasheet for Micron RC28F256P30TF to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.