256M-bit NOR Flash memory with a parallel interface, featuring 16M words x 16 bits. This surface-mount component operates at 1.8V with a maximum access time of 100ns. It utilizes a 64-pin EZBGA package (13x10x0.78mm) with a 1mm pin pitch. The memory architecture is sectored with asymmetrical block organization and includes a top boot block. Operating temperature range is -40°C to 85°C.
PackageEZBGA
MountingSurface Mount
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Technical Specifications
Micron RC28F256P30TF technical specifications.
General
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | EZBGA |
| Pin Count | 64 |
| PCB | 64 |
| Package Length (mm) | 13 |
| Package Width (mm) | 10 |
| Package Height (mm) | 0.78 |
| Seated Plane Height (mm) | 1.2(Max) |
| Pin Pitch (mm) | 1 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Density | 256Mbit |
| Interface Type | Parallel |
| Maximum Operating Current | 31mA |
| Block Organization | Asymmetrical |
| Architecture | Sectored |
| Programming Voltage | 0.9 to 3.6|8.5 to 9.5V |
| Timing Type | Asynchronous|Synchronous |
| Maximum Access Time | 100ns |
| Number of Words | 16M |
| Boot Block | Yes |
| Typical Operating Supply Voltage | 1.8V |
| Address Bus Width | 24bit |
| Location of Boot Block | Top |
| Number of Bits per Word | 16bit |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 85°C |
Compliance
| Cage Code | 6Y440 |
| EU RoHS | No |
| HTS Code | 8542320071 |
| Schedule B | 8542320070 |
| ECCN | 3A991.b.1.a |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Datasheet
Micron RC28F256P30TF Datasheet
Download the complete datasheet for Micron RC28F256P30TF to view detailed technical specifications.
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