512M-bit NOR Flash memory with parallel interface, offering 64M x 8 or 32M x 16 word configurations. Features a 100ns maximum access time and operates from 3V/3.3V supply. Housed in a 64-pin Fortified Ball Grid Array (BGA) package with surface mount capability, this component supports symmetrical block organization and sectored architecture, including boot block functionality at the bottom or top. Operating temperature range is -40°C to 85°C.
PackageFortified BGA
MountingSurface Mount
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Technical Specifications
Micron RC28F512M29EWH technical specifications.
General
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | Fortified BGA |
| Package Description | Fortified Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 64 |
| PCB | 64 |
| Package Length (mm) | 13 |
| Package Width (mm) | 11 |
| Package Height (mm) | 0.8 |
| Seated Plane Height (mm) | 1.4(Max) |
| Pin Pitch (mm) | 1 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Density | 512Mbit |
| Interface Type | Parallel |
| Maximum Operating Current | 31mA |
| Block Organization | Symmetrical |
| Architecture | Sectored |
| Programming Voltage | 11.5 to 12.5V |
| Timing Type | Asynchronous |
| Maximum Access Time | 100ns |
| Number of Words | 64M/32M |
| Boot Block | Yes |
| Typical Operating Supply Voltage | 3|3.3V |
| Address Bus Width | 26/25bit |
| Location of Boot Block | Bottom|Top |
| Number of Bits per Word | 8/16bit |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 85°C |
Compliance
| Cage Code | 6Y440 |
| EU RoHS | No |
| HTS Code | 8542320071 |
| Schedule B | 8542320070 |
| ECCN | 3A991.b.1.a |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Datasheet
Micron RC28F512M29EWH Datasheet
Download the complete datasheet for Micron RC28F512M29EWH to view detailed technical specifications.
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