High-performance Field Programmable Gate Array (FPGA) featuring 4608 Configurable Logic Blocks (CLBs) and 200,000 gates. This CMOS device operates at 80MHz and offers a 4608-cell architecture. Integrated ARM core supports multiple interfaces including I2C, SPI, Ethernet, UART, USART, and EBI/EMI. Packaged in a 256-pin LBGA (PBGA256) with dimensions of 17 x 17 mm and a height of 1.60 mm, it operates across a temperature range of -40°C to 100°C. Includes peripherals such as POR, WDT, and DMA, and is RoHS compliant.
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Microsemi A2F200M3F-FGG256I technical specifications.
| Package/Case | LBGA |
| Core Architecture | ARM |
| Interface | I2C, SPI, Ethernet, UART, USART, EBI/EMI |
| Max Operating Temperature | 100°C |
| Min Operating Temperature | -40°C |
| Package Quantity | 90 |
| Peripherals | POR, WDT, DMA |
| RoHS Compliant | Yes |
| Series | SmartFusion® |
| RoHS | Compliant |
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