1M-bit parallel EEPROM memory with 128K x 8 organization, featuring a 250 ns maximum access time. This surface-mount component operates from a 3V to 3.6V supply, with a typical operating voltage of 3.3V and a maximum operating current of 20 mA. Housed in a 32-pin Ceramic Flat Package (CFPAK) with flat leads, it offers 10 years of data retention and hardware data protection. Designed for a wide operating temperature range of -55°C to 125°C, this integrated circuit utilizes a lead-frame SMT basic package type.
PackageCFPAK
MountingSurface Mount
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Technical Specifications
Micross AS58LC1001F-25/883C technical specifications.
General
Basic Package Type
Lead-Frame SMT
Package Family Name
FPAK
Package/Case
CFPAK
Package Description
Ceramic Flat Package
Lead Shape
Flat
Pin Count
32
PCB
32
Package Length (mm)
21.08(Max)
Package Width (mm)
11.3(Max)
Package Height (mm)
3.12(Max)
Pin Pitch (mm)
1.4
Package Material
Ceramic
Mounting
Surface Mount
Density
1Mbit
Interface Type
Parallel
Maximum Access Time
250ns
Organization
128Kx8
Maximum Operating Current
20mA
Typical Operating Supply Voltage
3.3V
Density in Bits
1048576bit
Data Retention
10(Min)Year
Hardware Data Protection
Yes
Max Operating Supply Voltage
3.6V
Min Operating Supply Voltage
3V
Min Operating Temperature
-55°C
Max Operating Temperature
125°C
Programming Voltage
3 to 3.6V
Compliance
Cage Code
0LRZ0
HTS Code
8542320051
Schedule B
8542320050
ECCN
3A001.a.2.c
Automotive
No
AEC Qualified
No
PPAP
No
RoHS Versions
2002/95/EC
Datasheet
Micross AS58LC1001F-25/883C Datasheet
Download the complete datasheet for Micross AS58LC1001F-25/883C to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.