1M-bit EEPROM with a 128K x 8 organization, featuring a parallel interface and a maximum access time of 250 ns. This surface-mount component operates from a 3.0V to 3.6V supply, with a typical operating voltage of 3.3V and a maximum operating current of 20 mA. Housed in a 32-pin Ceramic Chip Scale Package (CSP) with a 1.4 mm pin pitch, it offers 10 years of data retention and hardware data protection. Designed for demanding environments, it operates across a temperature range of -55°C to 125°C.
PackageCSP
MountingSurface Mount
Quick Jump:
Technical Specifications
Micross AS58LC1001SF-25/883C technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
CSP
Package Description
Chip Scale Package
Lead Shape
Ball
Pin Count
32
PCB
32
Package Length (mm)
21.08(Max)
Package Width (mm)
11.3(Max)
Package Height (mm)
3.81(Max)
Pin Pitch (mm)
1.4
Package Material
Ceramic
Mounting
Surface Mount
Density
1Mbit
Interface Type
Parallel
Maximum Access Time
250ns
Organization
128Kx8
Maximum Operating Current
20mA
Typical Operating Supply Voltage
3.3V
Density in Bits
1048576bit
Data Retention
10(Min)Year
Hardware Data Protection
Yes
Max Operating Supply Voltage
3.6V
Min Operating Supply Voltage
3V
Min Operating Temperature
-55°C
Max Operating Temperature
125°C
Programming Voltage
3 to 3.6V
Compliance
Cage Code
0LRZ0
HTS Code
8542320051
Schedule B
8542320050
ECCN
3A001.a.2.c
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2002/95/EC
Datasheet
Micross AS58LC1001SF-25/883C Datasheet
Download the complete datasheet for Micross AS58LC1001SF-25/883C to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.