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Technical Specifications
NXP 1PS70SB16115 technical specifications.
General
| Average Rectified Current | 200mA |
| Package/Case | SOT-323 |
| Contact Plating | Tin |
| Forward Current | 200mA |
| Lead Free | Lead Free |
| Max Forward Surge Current (Ifsm) | 600mA |
| Max Operating Temperature | 125°C |
| Min Operating Temperature | -55°C |
| Max Repetitive Reverse Voltage (Vrrm) | 30V |
| Max Reverse Current | 2uA |
| Max Reverse Leakage Current | 2uA |
| Max Reverse Voltage (DC) | 30V |
| Max Surge Current | 600mA |
| Mount | Surface Mount |
| Package Quantity | 3000 |
| Packaging | Tape and Reel |
| Peak Non-Repetitive Surge Current | 600mA |
| Power Dissipation | 200mW |
| Radiation Hardening | No |
| Reach SVHC Compliant | No |
| RoHS Compliant | Yes |
Compliance
| RoHS | Compliant |
Datasheet
NXP 1PS70SB16115 Datasheet
Download the complete datasheet for NXP 1PS70SB16115 to view detailed technical specifications.
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