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Technical Specifications
NXP 74CBTLV16211DGG,11 technical specifications.
General
| Package/Case | TSSOP |
| Contact Plating | Gold |
| High Level Output Current | -128mA |
| Independent Circuits | 2 |
| Lead Free | Lead Free |
| Low Level Output Current | 128mA |
| Max Operating Temperature | 125°C |
| Min Operating Temperature | -40°C |
| Max Power Dissipation | 600mW |
| Max Supply Voltage | 3.6V |
| Min Supply Voltage | 2.3V |
| Mount | Surface Mount |
| Number of Bits | 24 |
| Number of Elements | 2 |
| Package Quantity | 35 |
| Packaging | Rail/Tube |
| Propagation Delay | 8.8ns |
| Quiescent Current | 50uA |
| Radiation Hardening | No |
| Series | 74CBTLV |
| Supply Current | 100mA |
| Supply Type | Single |
| Technology | CMOS |
| Turn-On Delay Time | 0.31ns |
Compliance
| RoHS | Compliant |
Datasheet
NXP 74CBTLV16211DGG,11 Datasheet
Download the complete datasheet for NXP 74CBTLV16211DGG,11 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.