PackageTFBGA
MountingSurface Mount
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Technical Specifications
NXP ASC8850ET,557 technical specifications.
General
| Package/Case | TFBGA |
| Core Architecture | ARM |
| Interface | SPI, USB, Ethernet, IrDA, MMC, SD, UART, USART, EBI/EMI |
| Max Operating Temperature | 85°C |
| Min Operating Temperature | 0°C |
| Mount | Surface Mount |
| Number of I/Os | 20 |
| Package Quantity | 126 |
| Packaging | Tray |
Compliance
| RoHS | Compliant |
Datasheet
NXP ASC8850ET,557 Datasheet
Download the complete datasheet for NXP ASC8850ET,557 to view detailed technical specifications.
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