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Technical Specifications
NXP BAS21VD,165 technical specifications.
General
| Average Rectified Current | 200mA |
| Package/Case | TSOP |
| Contact Plating | Tin |
| Forward Current | 200mA |
| Max Operating Temperature | 150°C |
| Min Operating Temperature | -65°C |
| Max Repetitive Reverse Voltage (Vrrm) | 250V |
| Max Reverse Leakage Current | 100nA |
| Max Reverse Voltage (DC) | 200V |
| Max Surge Current | 16A |
| Mount | Surface Mount |
| Package Quantity | 10000 |
| Packaging | Tape and Reel |
| Peak Non-Repetitive Surge Current | 16A |
| Reverse Recovery Time | 50ns |
| RoHS Compliant | Yes |
Compliance
| RoHS | Compliant |
Datasheet
NXP BAS21VD,165 Datasheet
Download the complete datasheet for NXP BAS21VD,165 to view detailed technical specifications.
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