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Technical Specifications
NXP BZB84-C30,215 technical specifications.
General
Package/Case
TO-236-3
Contact Plating
Tin
ESD Protection
No
Impedance
80R
Max Operating Temperature
150°C
Min Operating Temperature
-55°C
Max Power Dissipation
300mW
Max Reverse Leakage Current
50nA
Mount
Surface Mount
Package Quantity
3000
Packaging
Tape and Reel
RoHS Compliant
Yes
Tolerance
5%
Zener Voltage
30V
Compliance
RoHS
Compliant
Datasheet
NXP BZB84-C30,215 Datasheet
Download the complete datasheet for NXP BZB84-C30,215 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.