Quick Jump:
Technical Specifications
NXP BZB984-C6V8,115 technical specifications.
General
| Package/Case | SOT-663 |
| Contact Plating | Tin |
| ESD Protection | Yes |
| Height | 0.6mm |
| Impedance | 15R |
| Lead Free | Lead Free |
| Length | 1.7mm |
| Max Operating Temperature | 150°C |
| Min Operating Temperature | -65°C |
| Max Power Dissipation | 425mW |
| Max Reverse Current | 2uA |
| Max Reverse Leakage Current | 2uA |
| Mount | Surface Mount |
| Package Quantity | 4000 |
| Packaging | Tape and Reel |
| Power Dissipation | 425mW |
| RoHS Compliant | Yes |
| Tolerance | 5% |
| Voltage Tolerance | 5% |
| Width | 1.3mm |
| Working Voltage | 6.8V |
| Zener Current | 200mA |
| Zener Voltage | 6.8V |
Compliance
| RoHS | Compliant |
Datasheet
NXP BZB984-C6V8,115 Datasheet
Download the complete datasheet for NXP BZB984-C6V8,115 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.
Product Images
