MountingSurface Mount
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Technical Specifications
NXP BZT52H-B30,115 technical specifications.
General
| Contact Plating | Tin |
| Element Configuration | Single |
| ESD Protection | No |
| Impedance | 40R |
| Lead Free | Lead Free |
| Max Operating Temperature | 150°C |
| Min Operating Temperature | -65°C |
| Max Power Dissipation | 830mW |
| Max Reverse Leakage Current | 21uA |
| Mount | Surface Mount |
| Package Quantity | 3000 |
| Packaging | Tape and Reel |
| RoHS Compliant | Yes |
| Tolerance | 5% |
| Voltage Tolerance | 2% |
| Zener Voltage | 30V |
Compliance
| RoHS | Compliant |
Datasheet
NXP BZT52H-B30,115 Datasheet
Download the complete datasheet for NXP BZT52H-B30,115 to view detailed technical specifications.
No datasheet is available for this part.