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Technical Specifications
NXP BZT52HC16115 technical specifications.
General
| Impedance | 20R |
| Lead Free | Lead Free |
| Max Operating Temperature | 150°C |
| Min Operating Temperature | -65°C |
| Max Power Dissipation | 375mW |
| Max Reverse Leakage Current | 50nA |
| Mount | Surface Mount |
| Package Quantity | 1 |
| Packaging | Cut Tape |
| Radiation Hardening | No |
| Tolerance | 5% |
| Zener Voltage | 16V |
Compliance
| RoHS | Compliant |
Datasheet
NXP BZT52HC16115 Datasheet
Download the complete datasheet for NXP BZT52HC16115 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.