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Technical Specifications
NXP BZV55-B15115 technical specifications.
General
| Height | 1.6mm |
| Impedance | 30R |
| Lead Free | Lead Free |
| Length | 3.7mm |
| Max Operating Temperature | 200°C |
| Min Operating Temperature | -65°C |
| Max Power Dissipation | 500mW |
| Max Reverse Current | 50nA |
| Max Reverse Leakage Current | 50nA |
| Mount | Surface Mount |
| Package Quantity | 1 |
| Packaging | Cut Tape |
| Power Dissipation | 500mW |
| Radiation Hardening | No |
| Reach SVHC Compliant | No |
| RoHS Compliant | Yes |
| Termination | SMD/SMT |
| Tolerance | 2% |
| Width | 1.6mm |
| Working Voltage | 15V |
| Zener Voltage | 15V |
Compliance
| RoHS | Compliant |
Datasheet
NXP BZV55-B15115 Datasheet
Download the complete datasheet for NXP BZV55-B15115 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.