PackageMELF
MountingSurface Mount
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Technical Specifications
NXP BZV55-B3V6,115/BKN technical specifications.
General
| Package/Case | MELF |
| Element Configuration | Single |
| Max Operating Temperature | 200°C |
| Min Operating Temperature | -65°C |
| Max Power Dissipation | 500mW |
| Max Reverse Leakage Current | 5uA |
| Mount | Surface Mount |
| Zener Voltage | 3.6V |
Compliance
| RoHS | Compliant |
Datasheet
NXP BZV55-B3V6,115/BKN Datasheet
Download the complete datasheet for NXP BZV55-B3V6,115/BKN to view detailed technical specifications.
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