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Technical Specifications
NXP BZV55-C11135 technical specifications.
General
| Contact Plating | Tin, Matte |
| ESD Protection | No |
| Impedance | 20R |
| Lead Free | Lead Free |
| Max Operating Temperature | 200°C |
| Min Operating Temperature | -65°C |
| Max Power Dissipation | 500mW |
| Max Reverse Leakage Current | 100nA |
| Mount | Surface Mount |
| Package Quantity | 10000 |
| Packaging | Tape and Reel |
| Power Dissipation | 500mW |
| Tolerance | 5% |
| Voltage Tolerance | 5% |
| Zener Voltage | 11V |
Compliance
| RoHS | Compliant |
Datasheet
NXP BZV55-C11135 Datasheet
Download the complete datasheet for NXP BZV55-C11135 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.