Quick Jump:
Technical Specifications
NXP BZV85-C13,113 technical specifications.
General
| Package/Case | DO-41 |
| Contact Plating | Tin |
| ESD Protection | No |
| Impedance | 10R |
| Lead Free | Lead Free |
| Max Operating Temperature | 200°C |
| Min Operating Temperature | -65°C |
| Max Power Dissipation | 1.3W |
| Max Reverse Leakage Current | 200nA |
| Mount | Through Hole |
| Package Quantity | 5000 |
| Packaging | Tape and Reel |
| Power Dissipation | 1.3W |
| RoHS Compliant | Yes |
| Series | 200nA @ 9.1V |
| Tolerance | 5% |
| Voltage Tolerance | 5% |
| Zener Voltage | 13.25V |
Compliance
| RoHS | Compliant |
Datasheet
NXP BZV85-C13,113 Datasheet
Download the complete datasheet for NXP BZV85-C13,113 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.