PackageDO-41
MountingThrough Hole
Power1.3W
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Technical Specifications
NXP BZV85-C9V1,133 technical specifications.
General
| Package/Case | DO-41 |
| Contact Plating | Tin |
| Element Configuration | Single |
| ESD Protection | No |
| Impedance | 5R |
| Max Operating Temperature | 200°C |
| Min Operating Temperature | -65°C |
| Max Power Dissipation | 1.3W |
| Max Reverse Leakage Current | 700nA |
| Mount | Through Hole |
| Package Quantity | 5000 |
| Packaging | Ammo Pack |
| Power Dissipation | 1.3W |
| Radiation Hardening | No |
| RoHS Compliant | Yes |
| Tolerance | 5% |
| Voltage Tolerance | 5% |
| Zener Voltage | 9.05V |
Compliance
| RoHS | Compliant |
Datasheet
NXP BZV85-C9V1,133 Datasheet
Download the complete datasheet for NXP BZV85-C9V1,133 to view detailed technical specifications.
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