MountingSurface Mount
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Technical Specifications
NXP BZX585-B75,115 technical specifications.
General
| Lead Free | Lead Free |
| Max Operating Temperature | 150°C |
| Min Operating Temperature | -65°C |
| Max Power Dissipation | 300mW |
| Max Reverse Leakage Current | 50nA |
| Mount | Surface Mount |
| Packaging | Cut Tape |
| Radiation Hardening | No |
| RoHS Compliant | Yes |
| Zener Voltage | 75V |
Compliance
| RoHS | Compliant |
Datasheet
NXP BZX585-B75,115 Datasheet
Download the complete datasheet for NXP BZX585-B75,115 to view detailed technical specifications.
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