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Technical Specifications
NXP BZX585-C51,115 technical specifications.
General
Package/Case
SC
Contact Plating
Tin
ESD Protection
No
Impedance
180R
Max Operating Temperature
150°C
Min Operating Temperature
-65°C
Max Power Dissipation
300mW
Max Reverse Leakage Current
50nA
Mount
Surface Mount
Package Quantity
1
Packaging
Tape and Reel
Power Dissipation
300mW
RoHS Compliant
Yes
Tolerance
5%
Voltage Tolerance
5%
Zener Voltage
51V
Compliance
RoHS
Compliant
Datasheet
NXP BZX585-C51,115 Datasheet
Download the complete datasheet for NXP BZX585-C51,115 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.
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