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Technical Specifications
NXP BZX84-B12215 technical specifications.
General
| Package/Case | TO-236AB |
| Height | 1mm |
| Impedance | 25R |
| Lead Free | Lead Free |
| Length | 3mm |
| Max Operating Temperature | 150°C |
| Min Operating Temperature | -65°C |
| Max Power Dissipation | 250mW |
| Max Reverse Current | 100nA |
| Max Reverse Leakage Current | 100nA |
| Mount | Surface Mount |
| Package Quantity | 1 |
| Packaging | Cut Tape |
| Power Dissipation | 250mW |
| Radiation Hardening | No |
| Reach SVHC Compliant | No |
| Termination | SMD/SMT |
| Tolerance | 2% |
| Width | 1.4mm |
| Working Voltage | 12V |
| Zener Voltage | 12V |
Compliance
| RoHS | Compliant |
Datasheet
NXP BZX84-B12215 Datasheet
Download the complete datasheet for NXP BZX84-B12215 to view detailed technical specifications.
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