NXP CP3BT13K38/NOPB technical specifications.
| Package/Case | SOIC |
| Core Architecture | HC08 |
| Interface | SPI, SCI |
| Max Operating Temperature | 125°C |
| Memory Type | FLASH |
| Min Operating Temperature | -40°C |
| Mount | Surface Mount |
| Number of I/Os | 16 |
| Packaging | Tape and Reel |
| RoHS | Compliant |
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