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Technical Specifications
NXP LPC2290FBD144,551 technical specifications.
General
| Package/Case | LQFP |
| Core Architecture | ARM |
| Frequency | 72MHz |
| Interface | I2C, SPI, CAN, SSP, UART, USART, EBI/EMI |
| Max Operating Temperature | 85°C |
| Memory Type | ROMless, |
| Min Operating Temperature | -40°C |
| Max Supply Voltage | 3.6V |
| Min Supply Voltage | 1.65V |
| Mount | Surface Mount |
| Number of I/Os | 76 |
| Number of Timers/Counters | 2 |
| Oscillator Type | Internal |
| Package Quantity | 60 |
| Packaging | Tray |
| Peripherals | PWM, WDT |
| RAM Size | 64KB |
| RoHS Compliant | No |
| Series | LPC2200 |
Compliance
| RoHS | Not Compliant |
Datasheet
NXP LPC2290FBD144,551 Datasheet
Download the complete datasheet for NXP LPC2290FBD144,551 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.