Frequency72MHz
PackageLQFP
MountingSurface Mount
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Technical Specifications
NXP LPC2290FBD144,551 technical specifications.
General
Package/Case
LQFP
Core Architecture
ARM
Frequency
72MHz
Interface
I2C, SPI, CAN, SSP, UART, USART, EBI/EMI
Max Operating Temperature
85°C
Memory Type
ROMless,
Min Operating Temperature
-40°C
Max Supply Voltage
3.6V
Min Supply Voltage
1.65V
Mount
Surface Mount
Number of I/Os
76
Number of Timers/Counters
2
Oscillator Type
Internal
Package Quantity
60
Packaging
Tray
Peripherals
PWM, WDT
RAM Size
64KB
RoHS Compliant
No
Series
LPC2200
Compliance
RoHS
Not Compliant
Datasheet
NXP LPC2290FBD144,551 Datasheet
Download the complete datasheet for NXP LPC2290FBD144,551 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.