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Technical Specifications
NXP MC68HC908SR12CB technical specifications.
General
Access Time
8us
Package/Case
SDIP
Core Architecture
HC08
Interface
I2C, SCI
Lead Free
Contains Lead
Max Operating Temperature
85°C
Memory Size
12KB
Memory Type
FLASH,
Min Operating Temperature
-40°C
Number of I/Os
29
Oscillator Type
Internal
Package Quantity
13
Packaging
Rail/Tube
Peripherals
POR, PWM, LVD, Temp Sensor
RAM Size
512B
RoHS Compliant
No
Series
HC08
Compliance
RoHS
Not Compliant
Datasheet
NXP MC68HC908SR12CB Datasheet
Download the complete datasheet for NXP MC68HC908SR12CB to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.