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Technical Specifications
NXP MC908JK3CDWE technical specifications.
General
Package/Case
SOIC
Core Architecture
HC08
Max Operating Temperature
85°C
Memory Size
4KB
Memory Type
FLASH,
Min Operating Temperature
-40°C
Number of I/Os
15
Oscillator Type
External
Packaging
Rail/Tube
Peripherals
POR, PWM, LVD
Series
HC08
Compliance
RoHS
Compliant
Datasheet
NXP MC908JK3CDWE Datasheet
Download the complete datasheet for NXP MC908JK3CDWE to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.