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Technical Specifications
NXP MC908MR8MDWE technical specifications.
General
Package/Case
SOIC
Core Architecture
HC08
Halogen Free
Halogen Free
Interface
SCI
Max Operating Temperature
125°C
Memory Size
8KB
Memory Type
FLASH,
Min Operating Temperature
-40°C
Number of I/Os
12
Oscillator Type
Internal
Package Quantity
26
Packaging
Rail/Tube
Peripherals
POR, PWM, LVD
RoHS Compliant
Yes
Series
HC08
Compliance
RoHS
Compliant
Datasheet
NXP MC908MR8MDWE Datasheet
Download the complete datasheet for NXP MC908MR8MDWE to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.