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Technical Specifications
NXP MM908E621ACPEK/R2 technical specifications.
General
Package/Case
SOIC
Core Architecture
HC08
Data Bus Width
8b
Halogen Free
Halogen Free
Interface
SPI, SCI
Max Operating Temperature
85°C
Memory Type
FLASH
Min Operating Temperature
-40°C
Mount
Surface Mount
Number of I/Os
12
Package Quantity
1000
Packaging
Tape and Reel
Compliance
RoHS
Compliant
Datasheet
NXP MM908E621ACPEK/R2 Datasheet
Download the complete datasheet for NXP MM908E621ACPEK/R2 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.