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Technical Specifications
NXP MM908E622ACPEK/R2 technical specifications.
General
| Package/Case | SOIC |
| Core Architecture | HC08 |
| Halogen Free | Halogen Free |
| Interface | SPI, SCI |
| Max Operating Temperature | 85°C |
| Memory Type | FLASH |
| Min Operating Temperature | -40°C |
| Mount | Surface Mount |
| Number of I/Os | 12 |
| Package Quantity | 1000 |
| Packaging | Tape and Reel |
Compliance
| RoHS | Compliant |
Datasheet
NXP MM908E622ACPEK/R2 Datasheet
Download the complete datasheet for NXP MM908E622ACPEK/R2 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.