NXP
MM908E622ACPEK/R2
Integrated Quad Half Bridge, Triple High Side and EC Glass Driver 54-Pin SOIC W EP T/R
PackageSOIC
MountingSurface Mount
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Technical Specifications
NXP MM908E622ACPEK/R2 technical specifications.
General
Package/Case
SOIC
Core Architecture
HC08
Halogen Free
Halogen Free
Interface
SPI, SCI
Max Operating Temperature
85°C
Memory Type
FLASH
Min Operating Temperature
-40°C
Mount
Surface Mount
Number of I/Os
12
Package Quantity
1000
Packaging
Tape and Reel
Compliance
RoHS
Compliant
Datasheet
NXP MM908E622ACPEK/R2 Datasheet
Download the complete datasheet for NXP MM908E622ACPEK/R2 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.