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Technical Specifications
NXP MM908E624AYEW/R2 technical specifications.
General
| Package/Case | SOIC |
| Core Architecture | HC08 |
| Interface | SPI, SCI |
| Max Operating Temperature | 125°C |
| Memory Type | FLASH |
| Min Operating Temperature | -40°C |
| Mount | Surface Mount |
| Number of I/Os | 16 |
| Package Quantity | 1000 |
| Packaging | Tape and Reel |
| Weight | 0.027399oz |
Compliance
| RoHS | Compliant |
Datasheet
NXP MM908E624AYEW/R2 Datasheet
Download the complete datasheet for NXP MM908E624AYEW/R2 to view detailed technical specifications.
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