Frequency20MHz
PackageLQFP
Current8mA
MountingSurface Mount
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Technical Specifications
NXP MM912H634CV1AER2 technical specifications.
General
| Package/Case | LQFP |
| Core Architecture | HC08 |
| Interface | SPI, SCI |
| Max Frequency | 20MHz |
| Max Operating Temperature | 85°C |
| Memory Type | FLASH |
| Min Operating Temperature | -40°C |
| Mount | Surface Mount |
| Number of I/Os | 12 |
| Operating Supply Voltage | 5V |
| Package Quantity | 2000 |
| Packaging | Tape and Reel |
| Propagation Delay | 20ns |
| RoHS Compliant | Yes |
| Series | MM912_634 |
| Supply Current | 8mA |
| Weight | 0.006871oz |
Compliance
| RoHS | Compliant |
Datasheet
NXP MM912H634CV1AER2 Datasheet
Download the complete datasheet for NXP MM912H634CV1AER2 to view detailed technical specifications.
No datasheet is available for this part.