Frequency20MHz
PackageLQFP
Current8mA
MountingSurface Mount
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Technical Specifications
NXP MM912H634CV1AER2 technical specifications.
General
Package/Case
LQFP
Core Architecture
HC08
Interface
SPI, SCI
Max Frequency
20MHz
Max Operating Temperature
85°C
Memory Type
FLASH
Min Operating Temperature
-40°C
Mount
Surface Mount
Number of I/Os
12
Operating Supply Voltage
5V
Package Quantity
2000
Packaging
Tape and Reel
Propagation Delay
20ns
RoHS Compliant
Yes
Series
MM912_634
Supply Current
8mA
Weight
0.006871oz
Compliance
RoHS
Compliant
Datasheet
NXP MM912H634CV1AER2 Datasheet
Download the complete datasheet for NXP MM912H634CV1AER2 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.