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Technical Specifications
NXP P80C554SBBD,157 technical specifications.
General
Package/Case
LQFP
Core Architecture
8051
Interface
I2C, UART, USART, EBI/EMI
Max Operating Temperature
70°C
Memory Type
ROMless,
Min Operating Temperature
0°C
Number of I/Os
40
Oscillator Type
Internal
Package Quantity
160
Packaging
Tray
Peripherals
POR, PWM, WDT
RoHS Compliant
No
Series
80C
Compliance
RoHS
Not Compliant
Datasheet
NXP P80C554SBBD,157 Datasheet
Download the complete datasheet for NXP P80C554SBBD,157 to view detailed technical specifications.
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