PackageMELF
MountingSurface Mount
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Technical Specifications
NXP PHSBZV55C18T1 technical specifications.
General
| Package/Case | MELF |
| Element Configuration | Single |
| Max Operating Temperature | 200°C |
| Min Operating Temperature | -65°C |
| Max Power Dissipation | 500mW |
| Max Reverse Leakage Current | 50nA |
| Mount | Surface Mount |
| Zener Voltage | 17.95V |
Compliance
| RoHS | Compliant |
Datasheet
NXP PHSBZV55C18T1 Datasheet
Download the complete datasheet for NXP PHSBZV55C18T1 to view detailed technical specifications.
No datasheet is available for this part.