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Technical Specifications
NXP PUMD24,115 technical specifications.
General
| Package/Case | TSSOP |
| Lead Free | Lead Free |
| Max Operating Temperature | 150°C |
| Min Operating Temperature | -65°C |
| Mount | Surface Mount |
| Packaging | Cut Tape |
| Radiation Hardening | No |
| RoHS Compliant | Yes |
Compliance
| RoHS | Compliant |
Datasheet
NXP PUMD24,115 Datasheet
Download the complete datasheet for NXP PUMD24,115 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.