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Technical Specifications
NXP S908GZ60E1MFAE technical specifications.
General
| Package/Case | LQFP |
| Core Architecture | HC08 |
| Data Bus Width | 8b |
| Interface | SPI, CAN, SCI |
| Max Operating Temperature | 125°C |
| Memory Size | 60KB |
| Memory Type | FLASH, |
| Min Operating Temperature | -40°C |
| Number of I/Os | 37 |
| Oscillator Type | Internal |
| Packaging | Tray |
| Peripherals | POR, PWM, LVD |
| Series | HC08 |
Compliance
| RoHS | Compliant |
Datasheet
NXP S908GZ60E1MFAE Datasheet
Download the complete datasheet for NXP S908GZ60E1MFAE to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.