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Technical Specifications
NXP S9S08DV96F2MLH technical specifications.
General
Package/Case
LQFP
Core Architecture
HCS08
Data Bus Width
8b
Interface
SPI, SCI, I2C, CAN
Max Frequency
40MHz
Max Operating Temperature
125°C
Min Operating Temperature
-40°C
Max Supply Voltage
5.5V
Memory Size
96KB
Memory Type
FLASH,
Min Supply Voltage
2.7V
Number of Programmable I/O
87
Packaging
Tray
Radiation Hardening
No
RAM Size
4KB
Watchdog Timer
Yes
Compliance
RoHS
Compliant
Datasheet
NXP S9S08DV96F2MLH Datasheet
Download the complete datasheet for NXP S9S08DV96F2MLH to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.