Frequency25MHz
PackageTSSOP
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Technical Specifications
NXP S9S12GN32F0MLC technical specifications.
General
Package/Case
TSSOP
Core Architecture
HCS12
Data Bus Width
16b
Interface
SPI, SCI, CAN
Max Frequency
25MHz
Max Operating Temperature
85°C
Memory Size
32KB
Memory Type
FLASH,
Min Operating Temperature
-40°C
Number of I/Os
26
Number of Programmable I/O
26
Number of Timers/Counters
1
Operating Supply Voltage
5.5V
Package Quantity
360
Packaging
Tray
Radiation Hardening
No
RAM Size
2KB
RoHS Compliant
Yes
Compliance
RoHS
Compliant
Datasheet
NXP S9S12GN32F0MLC Datasheet
Download the complete datasheet for NXP S9S12GN32F0MLC to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.