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Technical Specifications
NXP S9S12GN32F0MLC technical specifications.
General
| Package/Case | TSSOP |
| Core Architecture | HCS12 |
| Data Bus Width | 16b |
| Interface | SPI, SCI, CAN |
| Max Frequency | 25MHz |
| Max Operating Temperature | 85°C |
| Memory Size | 32KB |
| Memory Type | FLASH, |
| Min Operating Temperature | -40°C |
| Number of I/Os | 26 |
| Number of Programmable I/O | 26 |
| Number of Timers/Counters | 1 |
| Operating Supply Voltage | 5.5V |
| Package Quantity | 360 |
| Packaging | Tray |
| Radiation Hardening | No |
| RAM Size | 2KB |
| RoHS Compliant | Yes |
Compliance
| RoHS | Compliant |
Datasheet
NXP S9S12GN32F0MLC Datasheet
Download the complete datasheet for NXP S9S12GN32F0MLC to view detailed technical specifications.
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