PackageLQFP
MountingSurface Mount
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Technical Specifications
NXP TDA9981BHL/8/C1;55 technical specifications.
General
Package/Case
LQFP
Max Operating Temperature
85°C
Min Operating Temperature
0°C
Mount
Surface Mount
Package Quantity
595
Packaging
Tray
Radiation Hardening
No
RoHS Compliant
Yes
Compliance
RoHS
Compliant
Datasheet
NXP TDA9981BHL/8/C1;55 Datasheet
Download the complete datasheet for NXP TDA9981BHL/8/C1;55 to view detailed technical specifications.
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