PackageLQFP
MountingSurface Mount
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Technical Specifications
NXP TDA9981BHL/8/C1;55 technical specifications.
General
| Package/Case | LQFP |
| Max Operating Temperature | 85°C |
| Min Operating Temperature | 0°C |
| Mount | Surface Mount |
| Package Quantity | 595 |
| Packaging | Tray |
| Radiation Hardening | No |
| RoHS Compliant | Yes |
Compliance
| RoHS | Compliant |
Datasheet
NXP TDA9981BHL/8/C1;55 Datasheet
Download the complete datasheet for NXP TDA9981BHL/8/C1;55 to view detailed technical specifications.
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