PackagePDIP
MountingThrough Hole
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Technical Specifications
NXP TEA1623PH/N1 technical specifications.
General
| Package/Case | PDIP |
| Max Operating Temperature | 85°C |
| Min Operating Temperature | -20°C |
| Mount | Through Hole |
| Packaging | Rail/Tube |
Compliance
| RoHS | Compliant |
Datasheet
NXP TEA1623PH/N1 Datasheet
Download the complete datasheet for NXP TEA1623PH/N1 to view detailed technical specifications.
No datasheet is available for this part.