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Technical Specifications
NXP TEA1703T/N1 technical specifications.
General
Package/Case
SOIC
Max Operating Temperature
150°C
Min Operating Temperature
-40°C
Packaging
Cut Tape
Reach SVHC Compliant
No
Topology
Flyback
Compliance
RoHS
Compliant
Datasheet
NXP TEA1703T/N1 Datasheet
Download the complete datasheet for NXP TEA1703T/N1 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.
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