PackageHTQFP EP
MountingSurface Mount
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Technical Specifications
NXP TZA3012HW/N1,551 technical specifications.
General
Basic Package Type
Lead-Frame SMT
Package Family Name
QFP
Package/Case
HTQFP EP
Package Description
Heat Sinked Thin Quad Flat Package, Exposed Pad
Lead Shape
Gull-wing
Pin Count
100
PCB
100
Package Length (mm)
14.1(Max)
Package Width (mm)
14.1(Max)
Package Height (mm)
1.05(Max)
Seated Plane Height (mm)
1.2(Max)
Pin Pitch (mm)
0.5
Package Material
Plastic
Mounting
Surface Mount
Compliance
Cage Code
H1R01
EU RoHS
Yes
HTS Code
8542310001
Schedule B
8517620050
ECCN
5A991.b.1
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
NXP TZA3012HW/N1,551 Datasheet
Download the complete datasheet for NXP TZA3012HW/N1,551 to view detailed technical specifications.
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