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Technical Specifications
Onsemi FODM8061 technical specifications.
General
| Basic Package Type | Lead-Frame SMT |
| Package Family Name | SOIC |
| Package/Case | Mini-Flat |
| Lead Shape | Gull-wing |
| Pin Count | 5 |
| PCB | 5 |
| Package Length (mm) | 4.3(Max) |
| Package Width (mm) | 4.6(Max) |
| Package Height (mm) | 2.11(Max) |
| Seated Plane Height (mm) | 2.4(Max) |
| Pin Pitch (mm) | 1.27 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Input Type | DC |
| Output Type | Open Collector |
| Number of Channels per Chip | 1 |
| Polarity | Inverting |
| Direction Type | Uni-Directional |
| Minimum Isolation Voltage | 3750Vrms |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 110°C |
| Maximum Data Rate | 10Mbps |
| Maximum Forward Current | 50mA |
Compliance
| Cage Code | 5V1P1 |
| EU RoHS | Yes |
| HTS Code | 8541408000 |
| Schedule B | 8541408000 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Datasheet
Onsemi FODM8061 Datasheet
Download the complete datasheet for Onsemi FODM8061 to view detailed technical specifications.
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