PackagePDIP
MountingThrough Hole
Power300mW
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Technical Specifications
Onsemi H11F2 technical specifications.
General
Package/Case
PDIP
Forward Current
16mA
Input Type
DC
Isolation Voltage
5.3kV
Lead Free
Lead Free
Max Operating Temperature
100°C
Min Operating Temperature
-55°C
Max Power Dissipation
300mW
Mount
Through Hole
Number of Channels
1
Number of Circuits
1
Number of Elements
1
Output Voltage
30V
Package Quantity
1000
Packaging
Bulk
Power Dissipation
300mW
Reverse Breakdown Voltage
5V
Reverse Voltage (DC)
5V
RoHS Compliant
Yes
Compliance
RoHS
Compliant
Datasheet
Onsemi H11F2 Datasheet
Download the complete datasheet for Onsemi H11F2 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.