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Technical Specifications
Onsemi H11F3SD technical specifications.
General
| Package/Case | SMD/SMT |
| Forward Current | 16mA |
| Input Type | DC |
| Isolation Voltage | 5.3kV |
| Lead Free | Lead Free |
| Max Input Current | 60mA |
| Max Operating Temperature | 100°C |
| Min Operating Temperature | -55°C |
| Max Power Dissipation | 300mW |
| Mount | Surface Mount |
| Number of Channels | 1 |
| Number of Elements | 1 |
| Output Voltage | 15V |
| Package Quantity | 1000 |
| Packaging | Tape and Reel |
| Power Dissipation | 300mW |
| Radiation Hardening | No |
| Reverse Breakdown Voltage | 5V |
| Reverse Voltage (DC) | 5V |
| RoHS Compliant | Yes |
Compliance
| RoHS | Compliant |
Datasheet
Onsemi H11F3SD Datasheet
Download the complete datasheet for Onsemi H11F3SD to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.
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