PackageSMD/SMT
MountingSurface Mount, Through Hole
Power250mW
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Technical Specifications
Onsemi H11L1FR2M technical specifications.
General
| Package/Case | SMD/SMT |
| Forward Current | 60mA |
| Input Type | DC |
| Isolation Voltage | 7.5kV |
| Lead Free | Lead Free |
| Max Operating Temperature | 85°C |
| Min Operating Temperature | -40°C |
| Max Output Current | 50mA |
| Max Power Dissipation | 250mW |
| Mount | Surface Mount, Through Hole |
| Number of Channels | 1 |
| Number of Circuits | 1 |
| Number of Elements | 1 |
| Output Current | 50mA |
| Output Current per Channel | 50mA |
| Package Quantity | 1000 |
| Packaging | Tape and Reel |
| Power Dissipation | 250mW |
| Propagation Delay | 4000ns |
| Reverse Breakdown Voltage | 6V |
| Series | H11L1M |
Compliance
| RoHS | Compliant |
Datasheet
Onsemi H11L1FR2M Datasheet
Download the complete datasheet for Onsemi H11L1FR2M to view detailed technical specifications.
No datasheet is available for this part.