PackageDIP
MountingThrough Hole
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Technical Specifications
Onsemi H11L1MX technical specifications.
General
| Package/Case | DIP |
| Fall Time | 0.1us |
| Isolation Voltage | 7.5kV |
| Max Input Current | 60mA |
| Mount | Through Hole |
Compliance
| RoHS | Compliant |
Datasheet
Onsemi H11L1MX Datasheet
Download the complete datasheet for Onsemi H11L1MX to view detailed technical specifications.
No datasheet is available for this part.