PackageDIP
MountingThrough Hole
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Technical Specifications
Onsemi H11L2W technical specifications.
General
| Package/Case | DIP |
| Input Type | DC |
| Max Operating Temperature | 100°C |
| Min Operating Temperature | -55°C |
| Max Output Current | 50mA |
| Max Power Dissipation | 150mW |
| Mount | Through Hole |
| Number of Channels | 1 |
| Output Current per Channel | 50mA |
| Packaging | Rail/Tube |
Compliance
| RoHS | Not Compliant |
Datasheet
Onsemi H11L2W Datasheet
Download the complete datasheet for Onsemi H11L2W to view detailed technical specifications.
No datasheet is available for this part.