PackageDIP
MountingThrough Hole
Power250mW
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Technical Specifications
Onsemi H11N2TM technical specifications.
General
Package/Case
DIP
Direction
Unidirectional
Fall Time
12ns
Forward Current
30mA
Input Type
DC
Max Operating Temperature
85°C
Min Operating Temperature
-40°C
Max Output Current
50mA
Max Power Dissipation
250mW
Mount
Through Hole
Number of Elements
1
Output Current
50mA
Output Current per Channel
50mA
Package Quantity
1000
Packaging
Bulk
Power Dissipation
250mW
Propagation Delay
100ns
Radiation Hardening
No
Reverse Breakdown Voltage
6V
RoHS Compliant
Yes
Series
H11N2TM
Turn-On Delay Time
330ns
Compliance
RoHS
Compliant
Datasheet
Onsemi H11N2TM Datasheet
Download the complete datasheet for Onsemi H11N2TM to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.