PackageDIP
MountingThrough Hole
Power250mW
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Technical Specifications
Onsemi MOC3032TM technical specifications.
General
| Package/Case | DIP |
| Forward Current | 60mA |
| Hold Current | 400uA |
| Isolation Voltage | 7.5kV |
| Lead Free | Lead Free |
| Max Operating Temperature | 85°C |
| Min Operating Temperature | -40°C |
| Mount | Through Hole |
| Number of Channels | 1 |
| Number of Circuits | 1 |
| Number of Elements | 1 |
| Package Quantity | 1000 |
| Packaging | Bulk |
| Power Dissipation | 250mW |
| Reverse Breakdown Voltage | 6V |
| RoHS Compliant | Yes |
| Series | MOC3032TM |
Compliance
| RoHS | Compliant |
Datasheet
Onsemi MOC3032TM Datasheet
Download the complete datasheet for Onsemi MOC3032TM to view detailed technical specifications.
No datasheet is available for this part.